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Original 500g Senju High temperature lead free solder paste/BGA soldering paste soldering paste
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Original 500g Senju High temperature lead free solder paste/BGA soldering paste soldering paste

MD-P001
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Description

Alloy: Sn96.5/Ag3/Cu0.5
Metal point 217 degree
Original 500g Senju High temperaturelead free solder paste/BGA soldering paste soldering paste

Detailed product discription

1.low/middle/high temperature available
2.high insulation
3.good quality and competitive price
4.fast delivery

specification
1. Excellent stability,resolving power for continuous printing; good viscosity
2. Without causing slumping, bridging or splashing of tin ball
3. Whtie plastic bottle, blue lid
4. Weight: 0.5kg/bottle
5. Alloy: Sn96.5/Ag3/Cu0.5
6. Metal point: 217 de

lead free soldering paste, bga solder flux,

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MINGDA TECHNOLOGY CO.,LTD

SMT pick and place machine; engraving machine; 3D printer; ESD products;

Address: 25G,Block B,Modern Window Building,Zhenhua Rd,FuTian District.Shenzhen.China,
Shenzhen, Guangdong
China, 518031

Tel: 0086-0755-82788221-804
Fax: 0086-0755-82783379

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