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Original 500g Senju solder paste, middle temperature lead free soldering paste, BGA soldering paste
MD-P001
Description
1.low/middle/high temperature available
2.high insulation
3.good quality and competitive price
4.fast delivery
specification
1. Excellent stability,resolving power for continuous printing; good viscosity
2. Without causing slumping, bridging or splashing of tin ball
3. Whtie plastic bottle, blue lid
4. Weight: 0.5kg/bottle
5. Alloy: Sn64/Bi35/Ag1
6. Melt point : 185 degree
Product usage:
The Lead Solder Paste is composed of environment-friendly flux and low oxidaton spherical powder,which were characterized by high print definition,excellent solderability and bright and smooth solder joint.
Tin solder paste had transparent residue and low solder ball rate, and excellent wetting ability on PCB.
For modern PCB-level electronic assembly using surface mount technology, solder paste is widely used as the joining material. We have made a lot of efforts to develop our solder paste with our own brand .With the aim to satisfy the market requirement and follow the developing tendency of environmental protection, systematical research works are being carried out. We will do our best to provide series of solder paste products marked with our own brand and excellent technical support to promote the cooperation between us.
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MINGDA TECHNOLOGY CO.,LTD
SMT pick and place machine; engraving machine; 3D printer; ESD products;
Address: 25G,Block B,Modern Window Building,Zhenhua Rd,FuTian District.Shenzhen.China,
Shenzhen, Guangdong
China, 518031
Tel: 0086-0755-82788221-804
Fax: 0086-0755-82783379
