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Automotive Battery Charger Circuit Board Assembly with Copper Clad

SYF-001

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Description

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Automotive Battery Charger Circuit Board Assembly with Copper Clad

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Key Specifications/Special Features |
1 | We SYF have 6 PCB production lines and 4 advanced SMT lines with high speed. |
2 | All kinds of integrated circuits are accepted,such as SO, SOP, SOJ, TSOP, TSSOP, ?QFP, DIP, CSP,BGA and U-BGA , Because Our placement precision can reach chip +0.1mm on integrated circuit parts. |
3 | We SYF can provide service of 0201 chip placement, through-hole components insertion and finished products fabrication, testing and packaging. |
4 | SMT/SMD assembly and through-hole components insertion |
5 | IC preprogramming |
6 | Function verification and burn in testing |
7 | Complete unit assembly (which including plastics, metal box, coil, cable inside and more) |
8 | Environmental coating |
9 | Engineering including end of life components, obsolete component replace and design support for circuit, metal and plastic enclosure |
10 | Packaging design and production of customized PCBA |
11 | 100% quality assurance |
12 | High mixed, low volume order is also welcomed. |
13 | Full component procurement or the substitute components sourcing |
14 | UL,ISO9001:2008, ROSH ,REACH,SGS,HALOGEN-FREE compliant |
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3.PCB?Assembly process capability

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PRODUCTION CAPABILITY OF PCB ASSEMBLY |
Stencil Size Range | ?756 mm x 756 mm |
Min. IC Pitch | ?0.30 mm |
Max. PCB Size | ?560 mm x 650 mm |
Min. PCB Thickness | ?0.30 mm |
Min. Chip Size | ?0201 (0.6 mm X 0.3 mm) |
Max. BGA Size | ?74 mm X 74 mm |
BGA Ball Pitch | ?1.00 mm (Min) / F3.00 mm (Max) |
BGA Ball Diameter | ?0.40 mm (Min) /F1.00 mm (Max) |
QFP Lead Pitch | ?0.38 mm (Min) /F2.54 mm (Max) |
Frequency of Stencil Cleaning | ?1 time / 5 ~ 10 Pieces |
Type of Assembly | ?SMT and Thru-hole |
Solder Type | ?Water Soluble Solder Paste,Leaded and Lead-free |
Type of Service | ?Turn-key,Partial Turn-key or consignment |
File Formats | ?Bill of Materials(BOM) |
?Gerber Files |
?Pick-N-Places(XYRS) |
Components | ?Passive Down to 0201 Size |
?BGA and VF BGA |
?Leadless Chip Carries/CSP |
?Double Sided SMT Assembly |
?BGA Repair and Reball |
?Part Removal and Replacement |
Component Packaging | ?Cut Tape,Tube,Reels,Loose Parts |
Testing Method | ?X-RAY Inspection and AOI Test |
Order of Quantity | ?High Mixed,Low Volume Order is also welcomed |
Remarks: In order to get accurate quote,the following information is required |
1 | Complete Data of Gerber Files for the Bare PCB Board. |
2 | Electronic Bill of Material(BOM) / Parts list detailing manufacturer& acute;s part number, quantity usage of components for reference. |
3 | Please state whether we can use alternative parts for passive components or not. |
4 | Assembly Drawings. |
5 | Functional Test Time Per Board. |
6 | Quality Standards Required |
7 | Send Us Samples (if available) |
8 | Date of the quote needs to be submitted |
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