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Multilayer ENIG surface finish Custom PCB Boards for communication

SYF-001

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Description

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Multilayer ENIG surface finish Custom PCB Boards for communication

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PRODUCT’S DETAILS |
Raw Material | FR-4 (Tg 180 available) |
Layer Count | 6-Layer |
Board Thickness | 1.6mm |
Copper Thickness | 2.0oz |
Surface Finish | ENIG(Electroless Nickel Immersion Gold) |
Solder Mask | Green |
Silkscreen | White |
Min. Trace Width/Spacing | 0.075/0.075mm |
Min. Hole Size | 0.25mm |
Hole Wall Copper Thickness | ≥20μm |
Measurement | 300×400mm |
Packaging | Inner: Vacuum-packed in soft plastic bales Outer: Cardboard Cartons with double straps |
Application | Communication,automobile,cell,computer,medical |
Advantage | Competitive Price,Fast Delivery,OEM&ODM,Free Samples, |
Special Requirements | Buried And Blind Via, Impedance Control, Via Plug, BGA Soldering And Gold Finger Are Acceptable |
Certification | UL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREE |
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PRODUCTION CAPABILITY OF PCB |
? PROCESS Engineer | ITEMS Item | ???????? ????????? PRODUCTION CAPABILITY Manufacturing Capability |
Laminate | Type | FR-1,FR-5,FR-4 High-Tg,ROGERS,ISOLA,ITEQ, ALUMINUM,CEM-1,CEM-3,TACONIC,ARLON,TEFLON |
Thickness | 0.2～3.2mm |
Production Type | ??? Layer Count | 2L-16L |
Surface Treatment | ?HAL,Gold Plating,Immersion Gold,OSP,Immersion Silver,Immersion Tin,Lead Free HAL |
?Cut Lamination | Max. Working Panel size | ?1000×1200mm |
?Inner Layer | ?Internal Core Thickness | 0.1～2.0mm |
?Internal width/spacing | Min: 4/4mil |
?Internal Copper Thickness | 1.0~3.0oz |
?Dimension | Board Thickness Tolerance | ±10% |
?Interlayer Alignment | ±3mil |
Drilling | ?Manufacture Panel Size | Max: 650×560mm |
?Drilling Diameter | ≧0.25mm |
?Hole Diameter Tolerance | ±0.05mm |
?Hole Position Tolerance | ±0.076mm |
?Min.Annular Ring | 0.05mm |
PTH+Panel Plating | ?Hole Wall copper Thickness | ≧20um |
?Uniformity | ≧90% |
?Outer Layer | ?Track Width | Min: 0.08mm |
Track Spacing | Min: 0.08mm |
?Pattern Plating | ?Finished Copper Thickness | 1oz～3oz |
EING/Flash Gold | ?Nickel Thickness | 2.5um~5.0um |
?Gold Thickness | 0.03~0.05um |
Solder Mask | Thickness | 15～35um |
?Solder Mask Bridge | 3mil |
?Legend | ?Line width/Line spacing | 6/6mil |
?Gold Finger | ?Nickel Thickness | ≧120u〞 |
?Gold Thickness | 1～50u〞 |
?Hot Air Level | ?Tin Thickness | 100～300u〞 |
?Routing | ?Tolerance of Dimension | ±0.1mm |
?Slot Size | Min:0.4mm |
Cutter Diameter | 0.8～2.4mm |
?Punching | ?Outline Tolerance | ±0.1mm |
Slot Size | Min:0.5mm |
V-CUT | ?V-CUT Dimension | Min:60mm |
?Angle | 15°30°45° |
?Remain Thickness Tolerance | ±0.1mm |
Beveling | Beveling Dimension | 30～300mm |
Test | Testing Voltage | 250V |
Max.Dimension | 540×400mm |
Impedance Control | ? ??? Tolerance ? | ±10% |
Aspect Ration | 12:1 |
Laser Drilling Size | 4mil(0.1mm) |
Special Requirements | Buried And Blind Via, Impedance Control, Via Plug, BGA Soldering and Gold Finger Are Acceptable |
OEM&ODM Service | Yes |
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