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PCB Design And Signal Integrit

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Description

Topscom has extensive experience in PCB design and signal integrity ranging from tiny medical devices to very dense, high-speed telecommunications boards. Topscom supports multiple PCB design platforms including Allegro, Mentor, PADs, Theta and IPL. An ISO 9001-approved five-step development methodology allows customers to review milestones after each critical point in the design. By using eFlexDesignSM and Valor QA and DFX tools along the entire process, PCB designers at Topscom leverage assembly and fabrication design guidelines that allow them to perform extensive design checks in a shorter period of time and transfer designs from one production site to another without costly redesigns.Our?pcb design lay out Capabilities?rough information:? Capabilities?ItemsExperienceCapabilityYear Experience10N/ALayout Size16& acute;& acute; X 13& acute;& acute;All dimensionPoint Connect20,000 pinDesign dependentLayers20 layersDesign dependentSpeedGIGA / OC48Up to 10 GTrace Thickness?, 1 oz Cu> ? oz CuTrace Width5/6/8 mil> 3 milMaterialFR-4 natural expoxyFR 4-06Dielectric Thickness5 mil< 4 milBackplane24 layersDesign dependentICT Test Point100%100%

PCB Design And Signal Integrit, Design Service,

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Topscom technology.Co.,LtD

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Address: No 18, Tannan Road,Tanjia Industrial Village,Gongming Street,Guangming New District,Shenzhen City,China.,
shenzhen, guangdong
China, 518000

Tel: 86-755-22211988
Fax: 86-755-22211988

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