Cast & Forged
Thermal Phase Changing Low Melting Materials , Heat Sensitive Materials For Notebook
TIC?808G series
Description
Thermal Phase Changing Low Melting Materials , Heat Sensitive Materials For Notebook
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TIC?800G series is? low melting point thermal interface material. At 50℃, TIC?800G series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.TIC?800G series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.
TIC?800G Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures.
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Applications Include:
> High Frequency Microprocessors
> Notebook and Desktop PCs
> Computer Serves
> Memory Modules
> Cache Chips
> IGBTs
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Features:
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For Lowest Thermal Resistance :
> 0.014℃-in2 /W thermal resistance
> Naturally tacky at room temperature,
? ? ?no adhesive required??????????? ?
> No heat sink preheating required
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Typical Properties of TICTM800G Series |
Product Name | TICTM805G | TICTM808G | TICTM810G | TICTM812G | Test Method |
Color | Gray | Gray | Gray | Gray | Visual |
Thickness | 0.005& quot;
(0.126mm) | 0.008& quot;
(0.203mm) | 0.010& quot;
(0.254mm) | 0.012& quot;
(0.305mm) | |
Thickness Tolerance? | ±0.0008& acute;& acute;
(±0.019mm) | ±0.0008& acute;& acute;
(±0.019mm) | ±0.0012& acute;& acute;
(±0.030mm) | ±0.0012& acute;& acute;
(±0.030mm) | |
Density | 2.6g/cc | Helium Pycnometer |
Temperature range | -25℃～125℃ | |
Phase Change Softening Temperature | 50℃~60℃ | |
& quot;Burn In& quot; Temperature | 70℃ for 5 minutes | |
Thermal Conductivity | 5.0 W/mK | ASTM D5470 (modified) |
Thermal Impedance @ 50 psi(345 KPa) | 0.014℃-in2/W | 0.020℃-in2/W | 0.038℃-in2/W | 0.058℃-in2/W | ASTM D5470 (modified) |
0.09℃-cm2/W | 0.13℃-cm2/W | 0.25℃-cm2/W | 0.37℃-cm2/W |
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Standard Thicknesses:
0.005& quot;(0.127mm)????????? 0.008& quot;(0.203mm)????????? 0.010& quot;(0.254mm)??????? 0.0012& quot;(0.305mm)?????????????????????? ?
Consult the factory alternate thickness.
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Standard Sizes:
?10& quot; x 16& quot;(254mm x 406mm)?????? 16& quot; X 400& acute;?? (406mm X 121.92M)???????????? ?
TIC?800 series are supplied with a white release paper and a bottom liner. TIC800? series is available in kiss cut an extended pull tab liner or individual die cut shapes.
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Peressure Sensitive Adhesive:
Peressure Sensitive Adhesive is not applicable for TIC?800 series products.
Reinforcement:
No reinforcement is necessary.
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Dongguan Ziitek Electronic Materials & Technology company
Phase Changing Materials,Thermal Conductive Pad,Thermal Gap Filler
Address: Building B8, Industry District 鈪? Xicheng, Hengli Township, Dongguan City,
Dongguan, guangdong
China, 523000
Tel: 86-0769-38801208
Fax: 86-0769-83791290
