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Black Core FR4 Multilayer PCB Circuit Board with Transparent Solder Mask

Black Core FR4

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Description

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Black Core FR4 Multilayer PCB Circuit Board with Transparent Solder Mask

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Key Specifications/Special Features

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Number. of Layers: | 4 |
Laminate Material: | FR4 |
Surface Finish: | HASL |
Copper Thickness: | 1 oz |
Board Thickness: | 1.6mm |
Board Size: | ? |
Color of Mask: | Transparent |
Color of Silkscreen: | White |
Flammability: | UL 94V-0 |
Workmanship: | Compliance with IPC-A-600 & IPC-6012 CLASS II |
Thermal Conductivity | - |
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Advantage

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1. Factory directly
2. Comprehensive quality control system

3. Competitive price
4. Quick turn: delivery time from 48hours.
5. Certification (ISO/UL E354810/ RoHS)

6. 8 years experience in exporting service

7. No MOQ/MOV.

8. High quality. Strict through the AOI (Automated Optical Inspection), QA/QC, flying probe, E-testing, etc.

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Product Application

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PCBs are applied to a wide range of High-tech industries such as: LED, telecommunication, computer application, lighting, game machine, industrial control, power, automobile and high-end consumer electronics, ect. By unremitting work and effort to the marketing, products exports to American, Canada, Europe counties, Africa and other Asia-pacific countries

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Capacity

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　 | High precision prototype | PCB bulk production |
Max Layers | 1-28 layers | 1-14 layers |
MIN Line width(mil) | 3mil | 4mil |
MIN Line space(mil) | 3mil | 4mil |
Min via (mechanical drilling) | Board thickness≤1.2mm | 0.15mm | 0.2mm |
Board thickness≤2.5mm | 0.2mm | 0.3mm |
Board thickness＞2.5mm | Aspect Ration≤13:1 | Aspect Ration≤13:1 |
Aspect Ration | Aspect Ration≤13:1 | Aspect Ration≤13:1 |
Board thickness | MAX | 8mm | 7mm |
MIN | 2 layers:0.2mm;4 layers:0.35mm;6 layers:0.55mm;8 layers:0.7mm;10 layers:0.9mm | 2 layers:0.2mm;4 layers:0.4mm;6 layers:0.6mm;8layers:0.8mm |
MAX Board size | 610*1200mm | 610*1200mm |
Max copper thickness | 0.5-6oz | 0.5-6oz |
Immersion Gold/ Gold Plated Thickness | Immersion Gold:Au,1—8u”
Gold finger:Au,1—150u”
Gold Plated:Au,1—150u”
Nickel Plated :50—500u” | 　 |
Hole copper thick | 25um 1mil | 25um 1mil |
Tolerance | Board thickness | Board thickness≤1.0mm:+/-0.1mm
1.0mm Board thickness>2.0mm:+/-8% | Board thickness≤1.0mm:+/-0.1mm
1.0mm Board thickness>2.0mm:+/-8% |
Outline Tolerance | ≤100mm:+/-0.1mm
100< ≤300mm:+/-0.15mm
>300mm:+/-0.2mm | ≤100mm:+/-0.13mm
100< ≤300mm:+/-0.15mm
>300mm:+/-0.2mm |
Impedance | ±10% | ±10% |
MIN Solder mask bridge | 　0.08mm | 　0.10mm |
Plugging Vias capability | 　0.25mm--0.60mm | 　0.70mm--1.00mm |
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