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Description
Chip-On-Glass (COG) is a flip chip bonding method which
is used for connect assembly of bare integrated circuits
on glass substrate directly by using Anisotropic Conductive Film .
The pitch of the IC bumps can be scaled down according to customers& acute;
requirements . This method reduces the assembly area to the highest
possible packing density, which especially important to those
applications that space saving is crucial. It allows a
cost-effective mounting of driver chips because integrating
flex PCB is no longer required. The IC is bonded directly onto
the glass substrate and is suitable for handling high-speed or high-frequency signals.
http://www.blazedisplay.com
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Blaze Display Technology Co., Ltd
Automotive LCD Displays
Address: 5/F, HSAE Tech Building, Hi-Tech Park, Nanshan, Shenzhen, 518057, China,
shenzhen, guangdong
China, 518000
Tel: 86-755-86524100
Fax: 86-755-86524101
