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Telecomunication10 Layer PCB Prototype Service Tg170 Immersion Gold

207022GB02

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Description

Telecomunication10 Layer PCB Prototype Service Tg170 Immersion Gold

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PCB Properties

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PCB SIZE | 245 x 221mm=1PCS |
BOARD TYPE | 　 |
Number of Layers | Multilayer PCB, 10 Layer PCB |
Surface Mount Components | YES |
Through Hole Components | YES |
LAYER STACKUP | copper ------- 35um(1oz)+plate TOP Signal |
4mil prepreg |
copper ------- 18um(0.5oz) GND Plane |
5mil FR-4 |
copper ------- 18um(0.5oz) SIG1 |
5mil prepreg |
copper ------- 18um(0.5oz) SIG2 |
5mil FR-4 |
copper ------- 18um(0.5oz) PWR Plane |
13mil prepreg |
copper ------- 18um(0.5oz) GND Plane |
5mil FR-4 |
copper ------- 18um(0.5oz) SIG3 |
5mil prepreg |
copper ------- 35um(1oz) SIG4 |
5mil FR-4 |
copper ------- 35um(1oz) GND Plane |
4mil prepreg |
copper ------- 35um(1oz)+plate BOT Signal |
TECHNOLOGY | 　 |
Minimum Trace and Space: | 4mil/4mil |
Minmum / Maximum Holes: | 0.3/2.6mm |
Number of Different Holes: | 32 |
Number of Drill Holes: | 18541 |
Number of Milled Slots: | 2 |
Number of Internal Cutouts: | 0 |
Impedance Control | Differential pairs impedance control, Layer 4 and layer 7, 4/6mil, 4/4mil 900ohm+/-10%. Single trace impedance control: Layer 1, L3, L4, L7, L8, L10, 4mil, 5mil, 5.8mil track 50ohm +/-10% |
BOARD MATERIAL | 　 |
Glass Epoxy: | FR-4, ITEQ IT-180 TG>170, er<5.4 |
Final foil external: | 1.5oz |
Final foil internal: | 0.5oz |
Final height of PCB: | 1.6mm ±0.16 |
PLATING AND COATING | 　 |
Surface Finish | Immersion Gold (30.1%) 2μ& quot; over 100μ& quot; nickle |
Solder Mask Apply To: | Top and Bottom, 12micon Minimum. |
Solder Mask Color: | Green, LP-4G G-05, Nanya supplied |
Solder Mask Type: | LPSM |
CONTOUR/CUTTING | Routing |
MARKING | 　 |
Side of Component Legend | TOP |
Colour of Component Legend | White, S-380W, Taiyo Supplied. |
Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
VIA | Plated Through Hole(PTH), via tented. |
FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE | 　 |
Outline dimension: | 0.0059& quot; (0.15mm) |
Board plating: | 0.0030& quot; (0.076mm) |
Drill tolerance: | 0.002& quot; (0.05mm) |
TEST | 100% Electrical Test prior shipment |
APPLICATION: | IP Telephony |
TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA | Worldwide, Globally. |
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Advantages

a) High Tg Material. Lead-Free Assembly Compatible, RoHS compliant and suitable for high thermal reliability needs, and Lead free assemblies with a maximum reflow temperature of 260℃

b) ENIG. Good oxidation resistance and good heat dissipation.

c) No MOQ, low cost for small quantity prototypes and samples.

d) Meeting your printed circuit board needs from PCB prototyping to mass volume production.

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More Applications in Electronics

Wifi Card
Bluetooth Printer
Solar Inverter
12V Power Inverter
Wireless Range Extender

Power Inverter
Power Supply Com
Power Switching Supply
Multi Chip Modules
Modular Oscilloscope

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PCB knowledge: Process of Multilayer PCB

A) In general, a multilayer board consists of a number of very thin print-and-etch inner layers, but drilling of holes has not been carried out. Outer layers of the multilayer board remain unetched.

B) Layers from top to bottom are bonded together in close registration by means of thin plies of prepreg. The bonding is performed under close temperature and pressure control in a lamination press.

C) After lamination, they are the processed in very much the same way as an ordinary double-sided PTH boards, i.e. holes are drilled, cleaned and plated. Outer layers are etched to develop the circuit pattern. Solder masks are applied and solder coating (HAS, ENIG etc) is performed.



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FAQ

What courier do you use for shipment?
Our courier includes DHL, Fedex, TNT and EMS. As per your order weight and location, we& acute;ll choose the most economic method to send you your boards to help to save the freight
cost.

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